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Low Density Surface Mount Process SMT Pallet For PCB Assembly

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Low Density Surface Mount Process SMT Pallet For PCB Assembly

Trung Quốc Low Density Surface Mount Process SMT Pallet For PCB Assembly nhà cung cấp
Low Density Surface Mount Process SMT Pallet For PCB Assembly nhà cung cấp Low Density Surface Mount Process SMT Pallet For PCB Assembly nhà cung cấp

Hình ảnh lớn :  Low Density Surface Mount Process SMT Pallet For PCB Assembly

Thông tin chi tiết sản phẩm:

Place of Origin: Dongguang China
Hàng hiệu: Chuangwei
Chứng nhận: CE ISO
Model Number: CWSFS

Thanh toán:

Minimum Order Quantity: 1 set
Giá bán: Negotiable
Packaging Details: each set be packed in plywood case
Delivery Time: 1-3 days after payment confirm
Payment Terms: T/T, L/C
Supply Ability: 3000 set per month
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Chi tiết sản phẩm
Colour: black Dimension: 1220x2440mm (can be customized)
Typically Color:: Blue/ black/ grey Density(g/mm3): 1.85
Standard OperationTemperature: 260 Application:: Wave soldering process and PCB assembly

 

Low Density Surface Mount Process SMT Pallet For PCB Assembly

 

 

I. Description

 

Durostone is a heavy-duty glass fiber reinforced plastic which offers extreme strength and excellent electrical, thermal and chemical properties. It can keep its mechanical strength, smoothness and original color when continuously used under the temperature of 280°C (max. working temperature below 385 degree 10~20sec).

In addition, durostone have the advantage of easily machining, high intensity and can be easily machining into special mechanical parts.

 

II. Main Characteristic

 

1. Normal working temperature at 325 °C, operating temperature up to 384 °C

2. Less distortion, low thermal conductivity

3. Superior dimensional stability, Long life

4. High temperature resistance
5. Resistance to chemical corrosion

6. High mechanical strength

7. Good machinability (low density)

 

III. Application

Functions:

1. Support thin baseboard or soft substrate circuit board

2. Carry an irregular shape solder pallet

3. Use multi-pak panel design to improve production efficiency

4. Prevent the deformation of the solder pallet during high temperature reflow soldering process

5. Smoothly surface, good endurance, applicable for Teflon spray painting

6. Avoid gold finger contamination by human contact

7. Protect bottom side SMT components during the wave soldering process

8. Prevent the deformation of the baseboard during the wave soldering process

9. Standardized the width of the production lines, eliminate the width adjustment of the production line

10. Prevent baseboard being contaminated by the overflow of tin

 

 

Benefits

 

1. Wave Solder Pallets provide strong, stable support for the PCB throughout the wave solder process
2. Wave Solder Pallets permit wave solder processing of through-hole components while masking solder-side SMT components and critical board features from molten solder
3. Wave Solder Pallets provide thermal protection for printed circuit board areas that are heat sensitive
4. Wave Solder Pallets allow processing of odd-shaped PCB's through conveyor system
5. Wave Solder Pallets prevent topside component movement throughout wave solder
6. Wave Solder Pallets align and position topside components throughout wave solder
7. Wave Solder Pallets increase assembly production by eliminating hand gluing and masking operations
8. Wave Solder Pallets ensure higher quality, repeatable process results
9. Wave Solder Pallets reduce bridging and skipping solder defects
10. Wave Solder Pallets provide safe, easy, ergonomic handling of PCB

 


Specification:
 

Model DurostoneCHP760 DurostoneCAS761 DurostoneCAG762
Grade Standard Anti-Static Anti-static(Optical)
Colour Blue Black Grey
Density(g/mm3) 1.85 1.85 1.85
Standard OperationTemperature 260 260 260
Maximum Operation Temperature(C) 350 350 350
Sheet Size(mm) 2440×1220 2440×1220 2440×1220
Tickness/weight(mm/kg) 3/17, 4/22 5/28, 6/33, 8/44 10/55, 12/66

 

 Low Density Surface Mount Process SMT Pallet For PCB Assembly

 

 

 

Working your way around the underside of the PCB, identify which components 
are parallel and perpendicular to the wave and assess the solderability of each 
PTH connector by comparing the actual separation against the graph right.

Ideally you want to be above the line in all cases.

 

Low Density Surface Mount Process SMT Pallet For PCB Assembly

 

 

 

CE approval

 

Low Density Surface Mount Process SMT Pallet For PCB Assembly

Từ khóa:

Smt Trays,

pcb carrier

Chi tiết liên lạc
Dongguan Chuangwei Electronic Equipment Manufactory

Người liên hệ: Alan Cao

Tel: +8613922521978

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